DocumentCode
1601995
Title
White light interferometry, a method for optical 3D-inspection of advanced packages
Author
Schaulin, M. ; Wolter, K.-J.
Author_Institution
Electron. Packaging Lab., Dresden Univ. of Technol., Germany
Volume
1
fYear
2004
Firstpage
42
Abstract
White light interferometry is a measuring method to acquire the shape of 3D surfaces very accurately. The paper presents an analysis of white light interferometry for its applicability in sensors for the assembly process of advanced packages. Aspects of the realization and the practical use of this measuring method for area array components are discussed.
Keywords
electronics packaging; inspection; light interferometry; shape measurement; 3D surface shape measurement; advanced packages; area array components; electronics packaging technology; optical 3D-inspection; white light interferometry; Assembly; Components, packaging, and manufacturing technology; Interference; Microscopy; Mirrors; Optical interferometry; Optical scattering; Optical sensors; Semiconductor device packaging; Shape measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004. 27th International Spring Seminar on
Print_ISBN
0-7803-8422-9
Type
conf
DOI
10.1109/ISSE.2004.1490373
Filename
1490373
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