• DocumentCode
    160201
  • Title

    Reduction of crosstalk in mixed CNT bundle interconnects for high frequency 3D ICs and SoCs

  • Author

    Sathyakam, P. Uma ; Karthikeyan, A. ; Rajesh, J. Kavish ; Mallick, P.S.

  • Author_Institution
    Sch. of Electr. Eng., VIT Univ., Vellore, India
  • fYear
    2014
  • fDate
    9-11 Jan. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper investigates the multi equivalent single conductor (MESC) model for mixed CNT bundles (MCBs) which contains metallic single and double walled CNTs at the core and semiconducting single walled CNTs at the periphery. This structure shows the least delay due to crosstalk.
  • Keywords
    carbon nanotubes; conductors (electric); crosstalk; system-on-chip; three-dimensional integrated circuits; MCBs; MESC model; SoCs; crosstalk reduction; delay; double walled CNTs; high frequency 3D ICs; metallic single CNTs; mixed CNT bundle interconnects; multiequivalent single conductor model; semiconducting single walled CNTs; Capacitance; Carbon nanotubes; Conductors; Crosstalk; Delays; Integrated circuit interconnections; Semiconductor device modeling; carbon nanotubes; crosstalk; interconnects; tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advances in Electrical Engineering (ICAEE), 2014 International Conference on
  • Conference_Location
    Vellore
  • Type

    conf

  • DOI
    10.1109/ICAEE.2014.6838461
  • Filename
    6838461
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=160201