Thermal stability of electroless nickel/immersion gold surface finish for direct bond copper

Author

Min-Su Kim ; Nishikawa, Hisashi

Author_Institution

Joining & Welding Res. Inst., Osaka Univ., Ibaraki, Japan

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

4

Abstract

We focus on the electroless nickel/immersion gold (ENIG) plating on a Cu disk and evaluate the initial characteristics of Ni(P) layer and the thermal stability of ENIG during the thermal storage test at 250°C in air condition. The initial plated Ni(P) contains about 6.5 wt.% phosphorus and shows the mixture of amorphous and small amount of nanocrystalline Ni. After the thermal storage up to 720 h at 250°C, the crystallization of Ni and phase transformation into Ni₃P are detected.

Keywords

copper; crystallisation; electroless deposited coatings; electroplating; gold; nickel; phase transformations; substrates; surface finishing; thermal stability; Cu; DBC substrate; ENIG plating; air condition; crystallization; direct bond copper; electroless nickel/immersion gold surface finish; nanocrystalline nickel; phase transformation; phosphorus; temperature 250 C; thermal stability; thermal storage test; Aging; Crystallization; Gold; Nickel; Surface finishing; Surface morphology; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962845

Filename

6962845