On-chip multilayer inductor design in near-field wireless connection for 3D-system integration

By using inductive coupling, near-field wireless transceivers can be implemented by digital CMOS circuits and on-chip inductors in standard CMOS process without additional process and no restriction of position. Compared with signal-layer inductor, on-chip multilayer inductors have more complicated and irregular structures and lack of process and design support. However, they are still attractive in wireless connection due to large amount of chip area saved and easier to form a coil so that IC interconnections can go through it. In this paper, with the emphasis on application to near-field wireless connection, an overall parameter fitting method is proposed to achieve the parameter extraction for the inductor model. Simulation is carried out to verify the effectiveness of the proposed equivalent model.