Comparison between organic and ceramic substrate insulation

Author

Bicakci, Aylin ; Eisele, Ronald ; Osterwald, Frank ; Olesen, Klaus

Author_Institution

Univ. of Appl. Sci. Kiel, Kiel, Germany

fYear

2014

fDate

16-18 Sept. 2014

Firstpage

1

Lastpage

6

Abstract

A study and comparison of substrates with ceramic and organic electrically insulating and thermally conductive layers for power electronic packages is presented. Reference is made to the “die on leadframe”-technology, to compare these structures with a commercial ceramic substrate. The focus of the study is on the thermal properties of the structures. Furthermore, a comprehensive overview of test methods and results for the breakdown voltage and the sheer strengths of the tested organic layers is given. The test results will be evaluated, if organic layers could be used as a substitute for standard ceramic substrates.

Keywords

ceramic insulation; conducting materials; electronics packaging; breakdown voltage; ceramic substrate insulation; die on leadframe-technology; organic electrically insulating layers; organic substrate insulation; power electronic packages; sheer strengths; test methods; thermal properties; thermally conductive layers; Ceramics; Copper; Substrates; Temperature measurement; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics System-Integration Technology Conference (ESTC), 2014

Conference_Location

Helsinki

Type

conf

DOI

10.1109/ESTC.2014.6962859

Filename

6962859