DocumentCode :
1602468
Title :
BioImplantable Bone Stress Sensor
Author :
Alfaro, J. Fernando ; Weiss, Lee E. ; Campbell, Phil G. ; Miller, Mark C. ; Heyward, Christa ; Doctor, John S. ; Fedder, Gary K.
Author_Institution :
The Robotics Inst., Carnegie Mellon Univ., Pittsburgh, PA
fYear :
2006
Firstpage :
518
Lastpage :
521
Abstract :
The clinical management of skeletal trauma and disease relies on radiographic imaging to infer bone quality. However, bone strength does not necessarily correlate well with image intensity. There is a need for a safe and convenient way to measure bone strength in situ. This paper presents a new technique to directly measure bone strength in situ at a microlevel scale through a microelectromechanical system (MEMS) sensor. The proposed MEMS stress sensor comprises an array of piezoresistive sensor "pixels" to detect stress across the interfacial area between the MEMS chip and bone with resolution to 100 Pa, in 1 sec averaging. The sensors are located within a textured surface to accommodate sensor integration into bone. From initial research, surface topography with 30-60 /mum features was found to be conducive to guiding new cell growth. Finite element analysis has led to a sensor design for normal and shear stress detection
Keywords :
bioMEMS; biomechanics; biomedical measurement; bone; finite element analysis; piezoresistive devices; prosthetics; stress measurement; surface topography; MEMS chip; bioimplant; bone strength; bone stress sensor; finite element analysis; microelectromechanical system; piezoresistive sensor; skeletal disease; skeletal trauma; surface topography; Biosensors; Bone diseases; Micromechanical devices; Quality management; Radio spectrum management; Radiography; Semiconductor device measurement; Sensor arrays; Stress; Surface topography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
Conference_Location :
Shanghai
Print_ISBN :
0-7803-8741-4
Type :
conf
DOI :
10.1109/IEMBS.2005.1616462
Filename :
1616462
Link To Document :
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