A model for verification of coupled high-speed packages and interconnects

Author

Simsek, Arzu ; Eder, Alfred

Author_Institution

Tech. Univ. Berlin, Germany

fYear

1993

Firstpage

538

Lastpage

541

Abstract

A method for verification of the interconnect system design for high-speed and high-density packages is described. To predict design tradeoffs the pertinent parameters are first determined. The electrical behaviors of the interconnects are simulated, and the results of coupling effects are discussed. A new modular SPICE-model has been developed which represents coupled multiconductors. This model can be used to analyze signal distortion and ground-bounce. With this model the SPICE code can be significantly reduced

Keywords

SPICE; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; modules; tape automated bonding; time-domain analysis; very high speed integrated circuits; TAB; VLSI; coupled multiconductors; design tradeoffs; equivalent circuits; ground-bounce; high-density packages; high-speed packages; interconnect system design; modular SPICE-model; multiple coupled transmission lines; signal distortion; verification; Capacitance; Circuit simulation; Coupling circuits; Crosstalk; Distributed parameter circuits; Equivalent circuits; Integrated circuit interconnections; Packaging; SPICE; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International

Conference_Location

Rochester, NY

Print_ISBN

0-7803-1375-5

Type

conf

DOI

10.1109/ASIC.1993.410841

Filename

410841