A floorplanning system for tape automated bonding packages

Author

Tseng, Jung-Ying ; Lin, David R J ; Chi, Mely Chen

Author_Institution

Design Autom. Dev. Dept., Ind. Technol. Res. Inst., Chutung, Hsinchu, Taiwan

fYear

1993

Firstpage

542

Lastpage

545

Abstract

Tape automated bonding (TAB) technology offers an ideal choice for packaging high pin count ICs. However, the manual routing for TAB is tedious and takes weeks to complete. The authors have developed a high performance router which completes routing in a few seconds on a PC-486. Compared to manual work, an average of 19% area reduction has been achieved. Based on the router, a floorplanning system which can be used in the early package design phase was built. A total of 30% area improvement has been shown by using this system. The system design flow and experimental results are described in detail

Keywords

circuit layout CAD; integrated circuit interconnections; integrated circuit packaging; network routing; tape automated bonding; design flow; early package design phase; floorplanning system; high performance router; high pin count ICs; tape automated bonding packages; Bonding; Communication industry; Computer industry; Design automation; Integrated circuit packaging; Joining processes; Pins; Routing; Topology; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

ASIC Conference and Exhibit, 1993. Proceedings., Sixth Annual IEEE International

Conference_Location

Rochester, NY

Print_ISBN

0-7803-1375-5

Type

conf

DOI

10.1109/ASIC.1993.410842

Filename

410842