DocumentCode
1603290
Title
Analysis of via impedance variations with a Polynomial Chaos method
Author
Jianxiang Shen ; Hanfeng Wang ; Ji Chen ; Jun Fan
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Houston, Houston, TX, USA
fYear
2011
Firstpage
899
Lastpage
904
Abstract
In this paper, we propose a systematic framework for the optimization and analysis of the equivalent characteristic impedance of practical via structures. The framework consists of (a) optimizing via structures for impedance matching using a Genetic algorithm, and (b) numerically characterize, by Polynomial Chaos (PC) method, the sensitivity of the equivalent characteristic impedance to the manufacturing uncertainties in the various geometrical parameters of a via structure. The PC method can be effectively used to compute important statistical information, such as moments, probabilities and sensitivities with respect to the design variables. The PC method is straightforward to implement, and can be orders of magnitude faster than the traditional Monte Carlo (MC) method. The proposed framework naturally leads to a rigorous methodology for EM design/control in the presence of multiple sources of uncertainty.
Keywords
Monte Carlo methods; chaos; genetic algorithms; impedance matching; polynomials; printed circuit layout; statistical analysis; EM design/control; Monte Carlo method; equivalent characteristic impedance; genetic algorithm; geometrical parameters; impedance matching; manufacturing uncertainties; polynomial chaos method; practical via structures; statistical information; via impedance variations; Impedance; Integrated circuit modeling; Mathematical model; Monte Carlo methods; Optimization; Polynomials; RLC circuits; optimization; polynomial chaos method; sparse grid method; statistical analysis; via impedance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location
Long Beach, CA, USA
ISSN
2158-110X
Print_ISBN
978-1-4577-0812-1
Type
conf
DOI
10.1109/ISEMC.2011.6038436
Filename
6038436
Link To Document