DocumentCode :
1603290
Title :
Analysis of via impedance variations with a Polynomial Chaos method
Author :
Jianxiang Shen ; Hanfeng Wang ; Ji Chen ; Jun Fan
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Houston, Houston, TX, USA
fYear :
2011
Firstpage :
899
Lastpage :
904
Abstract :
In this paper, we propose a systematic framework for the optimization and analysis of the equivalent characteristic impedance of practical via structures. The framework consists of (a) optimizing via structures for impedance matching using a Genetic algorithm, and (b) numerically characterize, by Polynomial Chaos (PC) method, the sensitivity of the equivalent characteristic impedance to the manufacturing uncertainties in the various geometrical parameters of a via structure. The PC method can be effectively used to compute important statistical information, such as moments, probabilities and sensitivities with respect to the design variables. The PC method is straightforward to implement, and can be orders of magnitude faster than the traditional Monte Carlo (MC) method. The proposed framework naturally leads to a rigorous methodology for EM design/control in the presence of multiple sources of uncertainty.
Keywords :
Monte Carlo methods; chaos; genetic algorithms; impedance matching; polynomials; printed circuit layout; statistical analysis; EM design/control; Monte Carlo method; equivalent characteristic impedance; genetic algorithm; geometrical parameters; impedance matching; manufacturing uncertainties; polynomial chaos method; practical via structures; statistical information; via impedance variations; Impedance; Integrated circuit modeling; Mathematical model; Monte Carlo methods; Optimization; Polynomials; RLC circuits; optimization; polynomial chaos method; sparse grid method; statistical analysis; via impedance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Conference_Location :
Long Beach, CA, USA
ISSN :
2158-110X
Print_ISBN :
978-1-4577-0812-1
Type :
conf
DOI :
10.1109/ISEMC.2011.6038436
Filename :
6038436
Link To Document :
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