Stability and reliability of thick film resistors constructed by different techniques

Comparison of the stability and reliability of thick film resistors prepared by different techniques is discussed in this work. This aim was accomplished by comparison of the thick film resistors prepared by etching and conventional thick film technology. The etching technique as a combination of three techniques (photolithography, LTCC processing and PCB patterning technology) was introduced for construction of "planar" resistors as a new idea. We show that it is possible to develop devices that are useful in standard thick film technology and that it is possible to fabricate 3D (planar) resistors with higher stability and reliability. As operating material we selected low temperature co-fired ceramic (LTCC), because it allows the fabrication of three-dimensional structures, and it is compatible with the screen-printing process.