Behaviors of flexible vertically aligned carbon nanotube bumps under compression

Author

Fujino, Masahisa ; Terasaka, Hidenori ; Suga, Tadatomo ; Soga, Lkuo ; Kondo, Daiyu ; Ishizuki, Yoshikatsu ; Iwai, Taisuke

Author_Institution

Dept. of Precision Eng., Univ. of Tokyo, Tokyo, Japan

fYear

2012

Firstpage

1

Lastpage

4

Abstract

In this research, bump-shaped Vertically Aligned Mutli-walled Carbon Nanotubes (VACNTs) were bonded to Au substrate as flip-chip interconnect, and the behaviors of the VACNT bumps under compression pressure were studied. In this model, it is considered that the VACNTs were deformed permanently by the friction among the VACNTs. In order to solve the cause of the permanent deformation of the VACNT bumps, the friction among the CNTs during the compression is calculated. Furthermore, the resistance of the VACNT bumps is measured, considering the amount of the deformation of the VACNT bumps.

Keywords

carbon nanotubes; deformation; flip-chip devices; friction; gold; integrated circuit interconnections; VACNT bumps; bump-shaped vertically aligned mutliwalled carbon nanotubes; compression pressure; flexible vertically aligned carbon nanotube bumps; flip-chip interconnect; friction; gold substrate; permanent deformation; Bonding; Gold; Image coding; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanotechnology (IEEE-NANO), 2012 12th IEEE Conference on

Conference_Location

Birmingham

ISSN

1944-9399

Print_ISBN

978-1-4673-2198-3

Type

conf

DOI

10.1109/NANO.2012.6322171

Filename

6322171