Title :
Mechanical testing of thin films
Author :
Vinci, R.P. ; Bravman, J.C.
Author_Institution :
Dept. of Mater. Sci. & Eng., Stanford Univ., CA, USA
Abstract :
The authors briefly discuss standard testing methods for thin films and compare them with a number of newer techniques. Basic material considerations in thin film stresses and deformation are summarized. Finally, microcantilever beam bending and wafer curvature experiments are presented as representative of recent work in mechanical testing of thin films.<>
Keywords :
materials testing; mechanical testing; stress measurement; thin films; deformation; mechanical testing; microcantilever beam bending; micromechanical device films; standard testing methods; stresses; thin films; wafer curvature; Dielectric thin films; Mechanical factors; Microelectronics; Optical films; Sputtering; Substrates; Temperature; Testing; Thermal stresses; Transistors;
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
DOI :
10.1109/SENSOR.1991.149045
