On-chip decoupling zone for package-stress reduction

Author

Spiering, V.L. ; Bouwstra, S. ; Spiering, R.M.E.J. ; Elwenspoek, M.

Author_Institution

Twente Univ., Enschede, Netherlands

fYear

1991

Firstpage

982

Lastpage

985

Abstract

The authors report the reduction of package stresses by introducing a decoupling zone directly around a sensor structure. Different geometries of the decoupling zones are compared, using the finite element method (FEM) and analytical models. Reduction factors over 1000 and higher can be realized by using an axisymmetrical V-corrugation. A design rule to optimize the reduction for the V-corrugation is given. This rule is based on analytical calculations and verified by FEM-simulations. Finally, it is shown that the thickness of a backplate, mounted to the sensor chip, can be optimized for minimal thermal stresses in the sensor.<>

Keywords

electric sensing devices; finite element analysis; integrated circuit technology; micromechanical devices; optimisation; packaging; semiconductor technology; thermal stresses; axisymmetrical V-corrugation; backplate; design rule; finite element method; micromechanical sensors; minimal thermal stresses; on-chip decoupling zone; optimisation; package-stress reduction; sensor structure; thickness; Actuators; Analytical models; Electronics packaging; Geometry; Mechanical engineering; Mechanical sensors; Micromechanical devices; Proposals; Silicon; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-87942-585-7

Type

conf

DOI

10.1109/SENSOR.1991.149055

Filename

149055