Dual function heat-spreading and performance of the IBM/ASTRON DOME 64-bit μServer demonstrator

Author

Luijten, Ronald P. ; Doering, Andreas ; Paredes, S.

Author_Institution

Cloud & Comput. Infrastruct., IBM Res. - Zurich, Zurich, Switzerland

fYear

2014

fDate

28-30 May 2014

Firstpage

1

Lastpage

4

Abstract

For the IBM-ASTRON DOME μServer project, we are currently building two types of memory DIMM-like form factor compute node boards. The first is based on a 4 core 2.2 GHz SoC and the second on a 12 core / 24 thread 1.8 GHz SoC. Both employ the 64-bit Power instruction set. Our innovative hot-water based cooling infrastructure also supplies the electrical power to our compute node board. We show initial performance results and conclude with the key lessons we have learnt and an outlook on our next activities.

Keywords

cooling; instruction sets; integrated circuit packaging; storage management chips; system-on-chip; 12 core-24 thread SoC; 4 core SoC; IBM-ASTRON DOME μServer demonstrator; dual function heat-spreading; electrical power; frequency 1.8 GHz; frequency 2.2 GHz; innovative hot-water based cooling infrastructure; memory DIMM-like form factor compute node boards; power instruction set; word length 64 bit; Cooling; Heating; Instruction sets; Packaging; Random access memory; Servers; System-on-chip; DOME; SKA; embedded systems; hot-water cooling; microserver SOC; packaging; power-efficiency;

fLanguage

English

Publisher

ieee

Conference_Titel

IC Design & Technology (ICICDT), 2014 IEEE International Conference on

Conference_Location

Austin, TX

Type

conf

DOI

10.1109/ICICDT.2014.6838613

Filename

6838613