Computational analysis and performance evaluation of representative wafer scale integration interconnections

The electrical performance of wafer-scale integration interconnections was studied, with an emphasis on the characteristic impedance. The study was based on closed-form expressions, finite difference method models, commercially available microwave circuit analysis software, and a numerical evaluation of the Telegrapher equations. Measurements were conducted on 5-in-diameter test wafers which contained numerous interconnection structures. The results revealed interesting information concerning the driving-point impedances of the structures, the inadequacy of closed-form models for accurate estimation, and the need for more accurate modeling techniques.<>