• DocumentCode
    1605493
  • Title

    Calculation & analysis of sequence impedance for parallel multi-circuit cable lines

  • Author

    Yuxue Wang ; Xiangping Kong ; Xing Deng ; Zhe Zhang ; Xianggen Yin

  • Author_Institution
    Hubei Electr. Power Security & High Efficiency Key Lab., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    As affected by electromagnetic coupling, the sequence impedance of parallel multi-circuit cable lines is different from that of single-circuit ones. Based on “conductor-ground” loop, derived from the matrix form of voltage equations, a new algorithm of parameters calculation for multi-circuit cable lines is presented. To consider the influence of metal sheath, the algorithm treats it the same as core conductor. They both form current loops with earth, referred to as “sheath-ground” loop and “core-ground” loop respectively. After a series of matrix operations to the voltage equations of these loops finally the sequence impedance matrix is obtained. The algorithm has taken adequate consideration for the electromagnetic coupling and is applicable to all types of metal sheath grounding schemes. Case study shows that the proposed algorithm has good accuracy. At the end of the paper, an instance of double-circuit cable lines is used to study the feature of parallel multi-circuit cable lines´ parameters.
  • Keywords
    cable sheathing; conductors (electric); earthing; electromagnetic coupling; impedance matrix; conductor ground loop; core conductor; core ground loop; electromagnetic coupling; metal sheath grounding; parallel multicircuit cable lines; sequence impedance matrix; sheath ground loop; voltage equations; Cable shielding; Grounding; Impedance; Mathematical model; Metals; Power cables; Wire; electromagnetic coupling; grounding scheme; multi-circuit cable lines; parallel running; parameter calculation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power System Technology (POWERCON), 2010 International Conference on
  • Conference_Location
    Hangzhou
  • Print_ISBN
    978-1-4244-5938-4
  • Type

    conf

  • DOI
    10.1109/POWERCON.2010.5666150
  • Filename
    5666150