Title :
Conformal antenna-in-package solution implemented in a 3D flex-rigid multilayer PCB technology
Author :
Enayati, Amin ; Libois, Michael ; De Raedt, Walter ; Vandenbosch, Guy A E
Author_Institution :
Inter-Univ. Microelectron. Center, IMEC, Leuven, Belgium
Abstract :
A three-dimensional antenna-in-package solution is introduced and explained in great details. The antenna is composed of three different parts: a metallic cube, an SSMA connector and antenna radiating arrays. The radiating elements are implemented and manufactured in a multilayer microwave-compatible PCB technology. The PCB includes flexible as well as rigid laminates. Having the flexible material available in the layer stack-up along with a custom-design procedure for patterning the rigid parts allows the PCB part to be shaped into a conformal array covering the metallic cube in a 3D way. Measurement and simulation results of the manufactured and assembled antenna show good agreement, confirming the reproducibility and reliability of the proposed solution for wireless sensor network nodes at 17.2 GHz.
Keywords :
antenna arrays; antenna radiation patterns; integrated circuit packaging; printed circuit manufacture; three-dimensional integrated circuits; wireless sensor networks; 3D flex-rigid multilayer PCB technology; SSMA connector; antenna radiating arrays; conformal antenna-in-package solution; conformal array; custom-design procedure; flexible material; metallic cube; multilayer microwave-compatible PCB technology; reliability; reproducibility; three-dimensional antenna-in-package solution; wireless sensor network nodes; Antenna arrays; Antenna measurements; Antenna radiation patterns; Dipole antennas; Face; Nonhomogeneous media; Three dimensional displays; Antenna-in-Package Approach; E-cubes; Microwave-compatible PCB Technology; System-in-Package Integration; Wireless sensor network;
Conference_Titel :
Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
Conference_Location :
Melbourne, VIC
Print_ISBN :
978-1-4577-2034-5
