• DocumentCode
    1605522
  • Title

    Conformal antenna-in-package solution implemented in a 3D flex-rigid multilayer PCB technology

  • Author

    Enayati, Amin ; Libois, Michael ; De Raedt, Walter ; Vandenbosch, Guy A E

  • Author_Institution
    Inter-Univ. Microelectron. Center, IMEC, Leuven, Belgium
  • fYear
    2011
  • Firstpage
    118
  • Lastpage
    121
  • Abstract
    A three-dimensional antenna-in-package solution is introduced and explained in great details. The antenna is composed of three different parts: a metallic cube, an SSMA connector and antenna radiating arrays. The radiating elements are implemented and manufactured in a multilayer microwave-compatible PCB technology. The PCB includes flexible as well as rigid laminates. Having the flexible material available in the layer stack-up along with a custom-design procedure for patterning the rigid parts allows the PCB part to be shaped into a conformal array covering the metallic cube in a 3D way. Measurement and simulation results of the manufactured and assembled antenna show good agreement, confirming the reproducibility and reliability of the proposed solution for wireless sensor network nodes at 17.2 GHz.
  • Keywords
    antenna arrays; antenna radiation patterns; integrated circuit packaging; printed circuit manufacture; three-dimensional integrated circuits; wireless sensor networks; 3D flex-rigid multilayer PCB technology; SSMA connector; antenna radiating arrays; conformal antenna-in-package solution; conformal array; custom-design procedure; flexible material; metallic cube; multilayer microwave-compatible PCB technology; reliability; reproducibility; three-dimensional antenna-in-package solution; wireless sensor network nodes; Antenna arrays; Antenna measurements; Antenna radiation patterns; Dipole antennas; Face; Nonhomogeneous media; Three dimensional displays; Antenna-in-Package Approach; E-cubes; Microwave-compatible PCB Technology; System-in-Package Integration; Wireless sensor network;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2011 Asia-Pacific
  • Conference_Location
    Melbourne, VIC
  • Print_ISBN
    978-1-4577-2034-5
  • Type

    conf

  • Filename
    6173700