DocumentCode :
1605568
Title :
Development of a process to build polyimide insulated magnets for operation at 350 C
Author :
Zatz, I.J. ; Jurczynski, S.
Author_Institution :
Princeton Plasma Phys. Lab., Princeton, NJ, USA
fYear :
2013
Firstpage :
1
Lastpage :
5
Abstract :
An extensive R&D program has been conducted that has confirmed the feasibility of designing and fabricating copper alloy magnets that can successfully operate at temperatures as high as 350C. The process, originally developed for the possibility of manufacturing in-vessel resonant magnetic field perturbation (RMP) coils for JET, has been optimized for insulated magnet (and, potentially, other high temperature component) applications. One of the benefits of high temperature operation is that active cooling may no longer be required, greatly simplifying magnet/component design. These elevated temperatures are beyond the safe operating limits of conventional OFHC copper and the epoxies that bond and insulate the turns of typical magnets. This would necessitate the use an alternative copper alloy conductor such as C18150 (CuCrZr). Coil manufacture with polyimide is very similar to conventional epoxy bonded coils. Conductors would be dry wound then impregnated with polyimide of low enough viscosity to permit saturation, then cured; similar to the vacuum pressure impregnation process used for conventional epoxy bonded coils. Representative polyimide insulated coils were mechanically tested at both room temperature and 350C. Mechanical tests included turn-to-turn shear bond strength and overall polyimide adhesion strength, as well as the flexural strength of a 48-turn polyimide-bonded coil bundle. This paper will detail the results of the testing program on coil samples. These results demonstrate mechanical properties as good, or better than epoxy bonded magnets, even at 350C.
Keywords :
Tokamak devices; fusion reactor design; fusion reactor materials; fusion reactor safety; magnets; plasma toroidal confinement; 48-turn polyimide-bonded coil bundle; JET; component design; conventional OFHC copper; conventional epoxy bonded coils; copper alloy magnets; epoxy bonded magnets; in-vessel RMP coils; magnet design; polyimide insulated magnets; resonant magnetic field perturbation coils; safe operating limits; temperature 350 C; turn-to-turn shear bond strength; vacuum pressure impregnation process; Coils; Conductors; Copper; Plasma temperature; Polyimides; Temperature measurement; Testing; Coils; Elevated temperature environment; Magnets; Mechanical testing; Polyimide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Fusion Engineering (SOFE), 2013 IEEE 25th Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-0169-2
Type :
conf
DOI :
10.1109/SOFE.2013.6635369
Filename :
6635369
Link To Document :
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