DocumentCode
1606343
Title
ASIC packaging directions
Author
Ramsay, F.R.
Author_Institution
Toshiba America Electron. Components Inc., Sunnyvale, CA, USA
fYear
1992
Firstpage
565
Lastpage
568
Abstract
Past and predicted future trends in ASIC packaging are examined. Specific issues addressed include ASIC packaging complexity; pin count; surface mount technology; pin grid arrays; quad flat packs; land grid arrays; tape automated bonding; and multichip modules
Keywords
application specific integrated circuits; multichip modules; packaging; surface mount technology; tape automated bonding; ASIC packaging; land grid arrays; multichip modules; packaging complexity; pin count; pin grid arrays; quad flat packs; surface mount technology; tape automated bonding; Application specific integrated circuits; CMOS technology; Electronic components; Electronics packaging; Frequency; Plastic packaging; Power dissipation; System performance; Voltage; Workstations;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Conference and Exhibit, 1992., Proceedings of Fifth Annual IEEE International
Conference_Location
Rochester, NY
Print_ISBN
0-7803-0768-2
Type
conf
DOI
10.1109/ASIC.1992.270198
Filename
270198
Link To Document