DocumentCode :
1606856
Title :
Improved Retention for a Al2O3 IPD Embedded Flash Cell without Top-Oxide
Author :
Power, J.R. ; Shum, D. ; Gong, Yu ; Bogacz, S. ; Haeupel, J. ; Estel, H. ; Strenz, Robert ; Kakoschke, R. ; van der Zanden, K. ; Allinger, R.
Author_Institution :
Infineon Technol. Dresden, GmbH & Co. OHG, Dresden
fYear :
2008
Firstpage :
93
Lastpage :
96
Abstract :
Using a 2Mb embedded Flash cell array as a demonstrator, we reported previously that a 3 V reduction in programming voltage was possible by replacing the ONO inter- poly dielectric (IPD) with an IPD comprising the high-k material, AI2O3 by Kakoschke, R., et al, (2007). Adding a thin protective top-oxide to the high-k IPD was later shown to significantly improve reliability in Power, J. R., et al, (2007). In this paper, we show that for integration schemes more suited to the material properties of AI2O3, reliably functioning 2 Mb demonstrators with a high-k IPD but without top-oxide protection are also feasible.
Keywords :
aluminium compounds; dielectric materials; flash memories; permittivity; IPD embedded flash cell; ONO inter-poly dielectric; embedded Flash cell array; programming voltage; reliably functioning; top-oxide protection; Aluminum oxide; Annealing; Character generation; High K dielectric materials; High-K gate dielectrics; Logic arrays; Material properties; Protection; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Non-Volatile Semiconductor Memory Workshop, 2008 and 2008 International Conference on Memory Technology and Design. NVSMW/ICMTD 2008. Joint
Conference_Location :
Opio
Print_ISBN :
978-1-4244-1546-5
Electronic_ISBN :
978-1-4244-1547-2
Type :
conf
DOI :
10.1109/NVSMW.2008.33
Filename :
4531833
Link To Document :
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