Title :
Nitride Thickness Scaling Limitations in TANOS Charge Trapping Devices
Author :
Melde, Thomas ; Beug, M. Florian ; Bach, Lars ; Riedel, Stephan ; Ludwig, Christoph ; Mikolaijck, Thomas
Author_Institution :
Qimonda Dresden GmbH & Co. OHG, Dresden
Abstract :
This article demonstrates that the scaling of the charge trap layer leads to an increasing charge loss in retention mode. This result is assigned to the fact that the blocking aluminum oxide is the main leakage path. It is further presented that the charge distribution moves towards the top oxide during programming and therefore shortens the distance to the leakage path. For thinner charge trap layers, the traps close to the aluminum oxide interface are already filled at lower DeltaVt resulting in higher retention loss for the same Vt shift.
Keywords :
NAND circuits; charge injection; electron traps; flash memories; leakage currents; TANOS charge trapping devices; aluminum oxide; charge distribution; charge loss; charge trap layer; leakage path; nitride thickness scaling limitations; retention loss; Aluminum oxide; Electron traps; Gas detectors; High K dielectric materials; High-K gate dielectrics; Lead compounds; SONOS devices; Silicon compounds; Tunneling; Voltage;
Conference_Titel :
Non-Volatile Semiconductor Memory Workshop, 2008 and 2008 International Conference on Memory Technology and Design. NVSMW/ICMTD 2008. Joint
Conference_Location :
Opio
Print_ISBN :
978-1-4244-1546-5
Electronic_ISBN :
978-1-4244-1547-2
DOI :
10.1109/NVSMW.2008.46