Title :
Transmission line models of multi-chip module interconnects
Author :
Ellis, Gary R. ; Mukund, P.R.
Author_Institution :
Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
Abstract :
An overview of the important transmission line properties of circuit interconnects is given, and it is shown how these properties can affect the operation of high speed and high density multichip modules (MCMs). Both frequency and time domain issues are addressed. The effects of line-caused delay and signal noise on MCM layouts are reported
Keywords :
crosstalk; delays; multichip modules; transmission line theory; MCM layouts; circuit interconnects; high density multichip modules; line-caused delay; multi-chip module interconnects; packaging; signal noise; transmission line properties; Clocks; Delay effects; Distributed parameter circuits; Integrated circuit interconnections; Logic gates; Propagation delay; Signal design; Switching circuits; Timing; Transmission lines;
Conference_Titel :
ASIC Conference and Exhibit, 1992., Proceedings of Fifth Annual IEEE International
Conference_Location :
Rochester, NY
Print_ISBN :
0-7803-0768-2
DOI :
10.1109/ASIC.1992.270246
