DocumentCode
1607500
Title
FDTD Analysis of Multichip Vertical Interconnects
Author
Rudnicki, Janusz ; Starski, J.P.
Author_Institution
Politechniki Warszawskiej, Warszawa
fYear
2006
Firstpage
346
Lastpage
349
Abstract
In this paper we present computer FDTD simulations for multichip interconnects between CPW transmission lines in two different layers and a CPW chip (CPW-CPW-CPW) using metallic, spherical bumps. We show that the main influence on the performance of the entire CPW-CPW-CPW structure has the first level of interconnection, where via holes are used. A reduction in return loss can be achieved by using small bump dimensions in the first level of the assembly.
Keywords
coplanar transmission lines; coplanar waveguides; finite difference time-domain analysis; flip-chip devices; integrated circuit interconnections; microwave integrated circuits; multichip modules; CPW flip-chip; CPW transmission lines; FDTD analysis; computer simulation; coplanar waveguides; metallic bumps; multichip vertical interconnects; spherical bumps; Assembly; Bonding; Capacitance; Coplanar waveguides; Finite difference methods; Frequency; Inductance; Integrated circuit interconnections; Time domain analysis; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwaves, Radar & Wireless Communications, 2006. MIKON 2006. International Conference on
Conference_Location
Krakow
Print_ISBN
978-83-906662-7-3
Type
conf
DOI
10.1109/MIKON.2006.4345187
Filename
4345187
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