Title :
FDTD Analysis of Multichip Vertical Interconnects
Author :
Rudnicki, Janusz ; Starski, J.P.
Author_Institution :
Politechniki Warszawskiej, Warszawa
Abstract :
In this paper we present computer FDTD simulations for multichip interconnects between CPW transmission lines in two different layers and a CPW chip (CPW-CPW-CPW) using metallic, spherical bumps. We show that the main influence on the performance of the entire CPW-CPW-CPW structure has the first level of interconnection, where via holes are used. A reduction in return loss can be achieved by using small bump dimensions in the first level of the assembly.
Keywords :
coplanar transmission lines; coplanar waveguides; finite difference time-domain analysis; flip-chip devices; integrated circuit interconnections; microwave integrated circuits; multichip modules; CPW flip-chip; CPW transmission lines; FDTD analysis; computer simulation; coplanar waveguides; metallic bumps; multichip vertical interconnects; spherical bumps; Assembly; Bonding; Capacitance; Coplanar waveguides; Finite difference methods; Frequency; Inductance; Integrated circuit interconnections; Time domain analysis; Wire;
Conference_Titel :
Microwaves, Radar & Wireless Communications, 2006. MIKON 2006. International Conference on
Conference_Location :
Krakow
Print_ISBN :
978-83-906662-7-3
DOI :
10.1109/MIKON.2006.4345187
