DocumentCode
1607715
Title
Challenges and opportunities in the broadband connected world
Author
Samueli, H.
Author_Institution
Broadcom Corp., Irvine, CA, USA
fYear
2004
Firstpage
2
Lastpage
3
Abstract
The communications IC industry is experiencing explosive growth as a result of the emergence of highly integrated, very low cost, mixed-mode (digital, analog and RF) system-on-a-chip (SoC) solutions that enable virtually every electronic device to be connected to a network. There are a multitude of communications technologies that are being developed to address the diverse demands of the connected user. The desirability of user mobility has driven wireless communications to be one of the fastest growing sectors of the communications IC industry. The requirement for very low power dissipation in these battery powered devices presents some unique challenges to the process technology industry as leakage currents and the inability to reduce power supply voltages much further become the limiting factors in choosing whether or not to adopt a next generation process node for a particular design.
Keywords
VLSI; system-on-chip; telecommunication equipment; broadband connected world; communications IC industry; electronic device; leakage currents; limiting factors; mixed-mode; network; next generation process node; system-on-a-chip; very low power dissipation; Analog integrated circuits; Communication industry; Digital integrated circuits; Electricity supply industry; Explosives; Radio frequency; Radiofrequency integrated circuits; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 2004. Digest of Technical Papers. 2004 Symposium on
Conference_Location
Honolulu, HI, USA
Print_ISBN
0-7803-8289-7
Type
conf
DOI
10.1109/VLSIT.2004.1345358
Filename
1345358
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