DocumentCode :
1607833
Title :
A 3-D Microelectrodes Array Microchip Applied to Cell Fusion
Author :
Zhiqiang, Zhao ; XiaoLin, Zheng ; Jiangong, Xiong ; Jianguo, Cui ; Jing, Wen ; Zhiguo, Li ; Xing, Wang
Author_Institution :
Coll. of Bioeng., Chongqing Univ.
fYear :
2006
Firstpage :
1282
Lastpage :
1285
Abstract :
A cell-to-cell fusion technique using 3-D microelectrodes array microchip has been developed. It permits cell-to-cell fusion operation in large amount simultaneously. And it needs much lower voltage (alternating voltage and pulse voltage) than the conventional cell fusion techniques. An array of 16 (4times4) microelectrodes can be fabricated on a 1times1cm silicon wafer. And an experimental system, including circuit control unit, temperature control unit, etc., has been developed to fuse cells. The alternating voltage is applied to the electrodes makes cells in alignment and in pairs firstly. Dielectrophoresis (DEP) force is used to form cell pairs in the microchip and makes cell pairs contact each other tightly. And then fusion of the cell pairs is induced by electric pulse is applied between electrodes. Microelectrodes of 8mum carbon-fiber are used to test the feasibility of the proposal experimental system. Human hepatocarcinoma SMMC-7721 cells are used as specimens. It´s observed that SMMC-7721 cells formed cell pairs and fused successfully
Keywords :
arrays; bioelectric potentials; cancer; carbon fibres; cellular biophysics; electrophoresis; microelectrodes; tumours; 3-D microelectrodes array microchip; C; Si; carbon fiber; cell-to-cell fusion technique; circuit control unit; dielectrophoresis force; human hepatocarcinoma SMMC-7721 cells; silicon wafer; temperature control unit; Circuits; Control systems; Dielectrophoresis; Electrodes; Fuses; Microelectrodes; Silicon; System testing; Temperature control; Voltage; array; cell fusion; microchip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
Conference_Location :
Shanghai
Print_ISBN :
0-7803-8741-4
Type :
conf
DOI :
10.1109/IEMBS.2005.1616660
Filename :
1616660
Link To Document :
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