Title :
Influence of PCBs coatings wettability on lead-free SMT solder joints reliability
Author :
Sitek, J. ; Drozd, Z. ; Bukat, K.
Author_Institution :
Tele & Radio Res. Inst., Warsaw, Poland
Abstract :
The paper presents results of wettability study of PCBs with immersion Sn, Ni/Au and SnCu coatings before reflow soldering process. Furthermore the solder joints were made in the optimal lead-free reflow soldering conditions using chosen materials with different wettability value of PCBs coatings and their reliability assessment was executed. The results of investigations have shown that exist direct influence PCBs coatings wettability on reliability of solder joints. It was find also that by using special procedure of PCBs coatings wettability assessment it is possible to predict future solder joints reliability.
Keywords :
circuit reliability; coatings; printed circuit design; soldering; wetting; PCB coatings wettability; lead-free SMT solder joints reliability; soldering process; Assembly; Coatings; Electronic equipment testing; Environmentally friendly manufacturing techniques; Gold; Lead; Materials testing; Reflow soldering; Surface-mount technology; Tin;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276466
