DocumentCode
1608106
Title
Technology and interconnect simulation for high-speed multi-chip modules
Author
Gilbert, John R.
Author_Institution
Motorola, Chandler, AZ, USA
fYear
1992
Firstpage
221
Abstract
High-performance systems utilizing ASICs must consider the ASIC interconnection impact on speed and signal quality. ASIC-to-ASIC interconnection is often the limiting factor. A systematic, modular approach to SPICE modeling and simulation is described. It incorporates off-chip drivers, pads, bonding, packaging and inter-ASIC interconnects. Emphasis is placed on device approximations in order to reduce circuit simulation time
Keywords
SPICE; application specific integrated circuits; digital simulation; multichip modules; packaging; ASIC interconnection; ASIC-to-ASIC interconnection; SPICE modeling; bonding; circuit simulation time; device approximations; high-speed multi-chip modules; inter-ASIC interconnects; off-chip drivers; packaging; signal quality; Application specific integrated circuits; Bonding; Circuit simulation; Driver circuits; Integrated circuit interconnections; MOSFETs; Packaging; SPICE; Silicon; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC Conference and Exhibit, 1992., Proceedings of Fifth Annual IEEE International
Conference_Location
Rochester, NY
Print_ISBN
0-7803-0768-2
Type
conf
DOI
10.1109/ASIC.1992.270273
Filename
270273
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