• DocumentCode
    1608452
  • Title

    GaN power electronics

  • Author

    Lu, Bin ; Piedra, Daniel ; Palacios, Tomás

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
  • fYear
    2010
  • Firstpage
    105
  • Lastpage
    110
  • Abstract
    Between 5 and 10% of the world´s electricity is wasted as dissipated heat in the power electronic circuits needed, for example, in computer power supplies, motor drives or the power inverters of photovoltaic systems. This paper describes how the unique properties of GaN enables a new generation of power transistors has the potential to reduce by at least an order of magnitude the cost, volume and losses of power electronic systems. We will describe three key technologies: Schottky drain contacts and substrate removal to increase the breakdown voltage, and a dual-gate device with superior enhancement-mode characteristics.
  • Keywords
    III-V semiconductors; Schottky barriers; cooling; gallium compounds; power supply circuits; power transistors; semiconductor device breakdown; GaN; Schottky drain contact; breakdown voltage; dual-gate device; enhancement-mode characteristic; heat dissipation; power electronic circuit; power transistor; substrate removal; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; Power electronics; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Devices & Microsystems (ASDAM), 2010 8th International Conference on
  • Conference_Location
    Smolenice
  • Print_ISBN
    978-1-4244-8574-1
  • Type

    conf

  • DOI
    10.1109/ASDAM.2010.5666311
  • Filename
    5666311