DocumentCode
1608452
Title
GaN power electronics
Author
Lu, Bin ; Piedra, Daniel ; Palacios, Tomás
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear
2010
Firstpage
105
Lastpage
110
Abstract
Between 5 and 10% of the world´s electricity is wasted as dissipated heat in the power electronic circuits needed, for example, in computer power supplies, motor drives or the power inverters of photovoltaic systems. This paper describes how the unique properties of GaN enables a new generation of power transistors has the potential to reduce by at least an order of magnitude the cost, volume and losses of power electronic systems. We will describe three key technologies: Schottky drain contacts and substrate removal to increase the breakdown voltage, and a dual-gate device with superior enhancement-mode characteristics.
Keywords
III-V semiconductors; Schottky barriers; cooling; gallium compounds; power supply circuits; power transistors; semiconductor device breakdown; GaN; Schottky drain contact; breakdown voltage; dual-gate device; enhancement-mode characteristic; heat dissipation; power electronic circuit; power transistor; substrate removal; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; Power electronics; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Devices & Microsystems (ASDAM), 2010 8th International Conference on
Conference_Location
Smolenice
Print_ISBN
978-1-4244-8574-1
Type
conf
DOI
10.1109/ASDAM.2010.5666311
Filename
5666311
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