Title :
Intermetallic compound growth in lead free solder joints on Ag-based thick film coductors
Author :
Bramlage, Silke ; Wolter, Klaus-Jurgen
Author_Institution :
Electron. Packaging Lab., Dresden Univ. of Technol., Dresden, Germany
Abstract :
In light of the RoHS-directive, that came into effect on July 1st 2006, lead free solders gained immensely in importance. The growth of the interfacial intermetallic compound layer between lead free solders and thick film metalizations was studied. A SnAg3.0Cu0.5-, a SnAg3.0Cu0.5Ni0.06Ge0.01- and a reactive-solder (SnCu1 + SnAg3.5 + Pd2) were tested on Ag-, Ag/Pd- and Ag/Pt-conductors. Samples were aged thermally for up to 1000 h at 150 degC and up to 168 h at 175 degC. It is shown that the growth of the intemetallic compound layer is much more dependent on the choice of metalization than on the chosen solder. Furthermore a model of the temperature-dependence of the diffusional constant for the combinations studied is presented.
Keywords :
RoHS compliance; ageing; copper alloys; germanium alloys; metallisation; nickel alloys; semiconductor growth; silver alloys; solders; thick film devices; tin alloys; RoHS-directive; SnAgCuNiGe; diffusional constant; interfacial intermetallic compound layer; intermetallic compound growth; lead free solder joint; thermal ageing; thick film conductor; thick film metalization; Bonding; Consumer electronics; Environmentally friendly manufacturing techniques; Intermetallic; Lead compounds; Scanning electron microscopy; Soldering; Temperature; Testing; Thick films; lead free solder; thick film;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276481
