X-ray diffraction study of copper-time intermetallic compounds on solder-coated PC boards

Author

Hong, Jauwhei ; Chason, Marc

Author_Institution

Motorola Inc., Ft. Lauderdale, FL, USA

fYear

1988

Firstpage

149

Lastpage

154

Abstract

X-ray diffraction has been used in conjunction with standard metallography to study the formation and growth of copper-tin intermetallic compounds and their effect on surface morphology on solder-coated printed-circuit boards. The diffraction technique lends itself very well to the detection of these compounds and to the monitoring of their evolution during thermal aging, especially in cases where coatings are so thin that various constituent phases cannot otherwise be discussed. Some growth characteristics revealed by this nondestructive method are presented.<>

Keywords

X-ray diffraction examination of materials; ageing; copper alloys; nondestructive testing; printed circuits; reliability; soldering; tin alloys; CuSn intermetallic compounds; NDT; X-ray diffraction study; growth characteristics; intermetallic compounds growth monitoring; nondestructive method; reliability; solder-coated PC boards; standard metallography; surface morphology; thermal aging; Aging; Atmosphere; Coatings; Conducting materials; Copper; Intermetallic; Performance evaluation; Surface morphology; Temperature measurement; X-ray diffraction;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International

Conference_Location

Lake Buena Vista, FL, USA

Type

conf

DOI

10.1109/EMTS.1988.16167

Filename

16167