Abstract :
Presents the table of contents of the proceedings.
Keywords :
Composite materials; Electronic equipment testing; Inorganic materials; Magnetic materials; Materials reliability; Packaging; Power system reliability; Semiconductor device reliability; Software packages; Thin film sensors;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
DOI :
10.1109/ISSE.2008.5276499
