Title :
Low Temperature Wafer Direct Bonding Between GaInAsP Etch Stop Layer and Gd/sub 3/Ga/sub 5/O/sub 12/
Author :
Yokoi, Hiroshi ; Mizumoto, Tetsuya
Author_Institution :
Tokyo Institute of Technology
Keywords :
Etching; Temperature; Wafer bonding;
Conference_Titel :
Lasers and Electro-Optics Europe, 1998. 1998 CLEO/Europe. Conference on
Conference_Location :
Glasgow, Scotland
Print_ISBN :
0-7803-4233X
DOI :
10.1109/CLEOE.1998.719515
