• DocumentCode
    1610664
  • Title

    Dynamic simulation model for two-phase mutually coupled reluctance machines

  • Author

    Reeve, J.M. ; Pollock, C.

  • Author_Institution
    Dept. of Eng., Leicester Univ., UK
  • Volume
    1
  • fYear
    2001
  • Firstpage
    40
  • Abstract
    This paper presents a simple yet robust and flexible dynamic simulation model for two-phase reluctance type machines. Normalized electromagnetic properties of the lamination geometry, the ´flux map´, are obtained using nonlinear magnetostatic finite element analysis (FEA). A data conversion algorithm is developed to convert this data into a form suitable for voltage driven dynamic simulation, i.e. a two-phase coupled flux-MMF-position characterization. System dynamic equations are derived and solved with the Gauss-Seidel method using the converted data without further need for FEA. Comparison with experimental results for an 8/4 flux switching machine with asymmetry shows good agreement. This model can be used to rapidly simulate any winding configuration or excitation scheme based upon the characterized geometry and is, thus, especially suitable for commercial design.
  • Keywords
    electromagnetic fields; finite element analysis; iterative methods; laminations; machine theory; magnetic flux; reluctance machines; Gauss-Seidel method; data conversion algorithm; dynamic equations; dynamic simulation model; electromagnetic properties; excitation scheme; flux map; lamination geometry; nonlinear magnetostatic finite element analysis; two-phase coupled flux-MMF-position characterization; two-phase mutually coupled reluctance machines; voltage driven dynamic simulation; winding configuration; Finite element methods; Geometry; Lamination; Magnetic flux; Magnetic properties; Magnetostatics; Mutual coupling; Nonlinear dynamical systems; Robustness; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 2001. Thirty-Sixth IAS Annual Meeting. Conference Record of the 2001 IEEE
  • Conference_Location
    Chicago, IL, USA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-7114-3
  • Type

    conf

  • DOI
    10.1109/IAS.2001.955390
  • Filename
    955390