Title :
Comparing of simulation and experimental results of chip power interconnection
Author :
Novotny, Marek ; Jankovsky, Jaroslav ; Szendiuch, Ivan
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
Abstract :
This paper describes recent developments made to the finite element modeling of wire bonding interconnection, extending its capability to handle viscoplastic behavior. In this project a test system to be used in investigation and research on reliability of interconnections in integrated circuits and printed circuit boards will be developed and realized. Especially the reliability of interconnections of semiconductor chips under high current regime until 10 A, or more, is emphasized.
Keywords :
finite element analysis; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; lead bonding; printed circuit testing; viscoelasticity; finite element modeling; integrated circuit interconnection; printed circuit boards; semiconductor chip power interconnection; test system; viscoplastic behavior; wire bonding interconnection reliability; Bonding; Circuit simulation; Circuit testing; Finite element methods; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit testing; Power system interconnection; Power system modeling; Wire;
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
DOI :
10.1109/ISSE.2008.5276578
