Comparing of simulation and experimental results of chip power interconnection

Author

Novotny, Marek ; Jankovsky, Jaroslav ; Szendiuch, Ivan

Author_Institution

Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic

fYear

2008

Firstpage

261

Lastpage

263

Abstract

This paper describes recent developments made to the finite element modeling of wire bonding interconnection, extending its capability to handle viscoplastic behavior. In this project a test system to be used in investigation and research on reliability of interconnections in integrated circuits and printed circuit boards will be developed and realized. Especially the reliability of interconnections of semiconductor chips under high current regime until 10 A, or more, is emphasized.

Keywords

finite element analysis; integrated circuit bonding; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; lead bonding; printed circuit testing; viscoelasticity; finite element modeling; integrated circuit interconnection; printed circuit boards; semiconductor chip power interconnection; test system; viscoplastic behavior; wire bonding interconnection reliability; Bonding; Circuit simulation; Circuit testing; Finite element methods; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit testing; Power system interconnection; Power system modeling; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Conference_Location

Budapest

Print_ISBN

978-1-4244-3972-0

Electronic_ISBN

978-1-4244-3974-4

Type

conf

DOI

10.1109/ISSE.2008.5276578

Filename

5276578