DocumentCode :
1611013
Title :
Transconductance related analysis of EKV MOSFET model for a 0.35 µm CMOS technology node
Author :
Singh, Kirmender ; Bhattacharyya, A.B.
Author_Institution :
Dept. of Electron. & Commun. Eng., Jaypee Inst. of Inf. Technol., Noida, India
fYear :
2010
Firstpage :
436
Lastpage :
440
Abstract :
Transconductance gm is an important parameter for small-signal analysis of analog circuits. It is paramount to analyse the gm and transconductance efficiency (gm/ID) as it provide useful design guidlines. The sensitivity of gm and (gm/ID) on process related parameters gives deeper insight of circuit performance. Amongst compact MOSFET models, EKV is known for its suitability in low power analog design due to its physical basis. Due to ever increasing complexity of other compact models, EKV is considered ideal as educational an analytical CMOS analog design tool. Notwitstanding ultimate role of BSIM for benchmark validation in the final stage. The paper outlines some useful classroom outcome on EKV experimentation. Firstly, EKV model parameters have been mapped from BSIM model file of 0.35 μm technology node to obtain DL, COX, GAMMA, PHI, KP etc. Next, the I-V curve used as reference data is generated using BSIM3v3, and EKV2.6 model equations are curve-fitted to obtain the best fit value of the EKV2.6 parameters.An optimization program is run for getting global fit value in all operating ranges and conditions, by finding the curve-fitting error. The sensitivity of drain current ID, gm, and (gm/ID) to process and model parameters is determined for strong and weak inversion conditions. The (gm/ID) dependency on inversion coefficient (IC) for different channel length has been shown for EKV2.6 model. The lumped transconductance parameters get resolved into various components providing deeper insight of the relationship of the transconductance parameter with specific physical phenomenon. The method illustrated for long channel can be extended for short channel and the dependence of all component on inversion level can be obtained.
Keywords :
CMOS analogue integrated circuits; MOSFET; circuit optimisation; curve fitting; integrated circuit modelling; semiconductor device models; BSIM; CMOS analog design tool; EKV MOSFET model; EKV2.6 parameters; analog circuits; benchmark validation; curve fitting error; inversion coefficient; optimization program; power analog design; size 0.35 mum; transconductance efficiency; Equations; Integrated circuit modeling; Mathematical model; Semiconductor device modeling; Sensitivity; Transconductance; (gm/ID) comparison; curve fitting error; parameter extraction; sensitivity; temperature dependent parameters; tranconductance subcomponents;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7011-2
Electronic_ISBN :
978-83-928756-4-2
Type :
conf
Filename :
5551279
Link To Document :
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