• DocumentCode
    1611079
  • Title

    Membrane behaviour of Parylene C as housing material

  • Author

    Engelien, E. ; Beshchasna, N. ; Braunschweig, M. ; Uhlemann, J. ; Wolter, K.-J.

  • Author_Institution
    Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2008
  • Firstpage
    650
  • Lastpage
    655
  • Abstract
    Investigation methods on polymer encapsulation were implemented to determine the quality of a polymer coating on electronic devices against migration and diffusion. Therefore the major goal was to evaluate a membrane of Parylene C clamped in a frame. Two different fluids in chambers on each side of the membrane, bi-distillated water and water with solute salt, generate concentration gradient. The potential drop drives ions through the membrane. With the analysis of the conductivity in the chamber with bi-distilled water the transmission rate of the molecules can be determined in dependence of mass and thickness to area and time. These tests have shown a coefficient for the transmission rate of NaCl. The inspection with the scanning electron microscope as well as measuring the surface roughness conducted to first information about thin Parylene C layers.
  • Keywords
    electronics packaging; encapsulation; ionic conductivity; membranes; polymer films; scanning electron microscopy; surface diffusion; surface roughness; Parylene C; bidistillated water; concentration gradient; diffusion; electronic devices; housing material; ionic conductivity; membrane behaviour; migration; molecule transmission rate; polymer coating; polymer encapsulation; scanning electron microscope; solute salt; surface roughness; Biomembranes; Conductivity; Electronics packaging; Environmental factors; Permeability; Polymer films; Protection; Surface topography; Testing; Toxicology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
  • Conference_Location
    Budapest
  • Print_ISBN
    978-1-4244-3972-0
  • Electronic_ISBN
    978-1-4244-3974-4
  • Type

    conf

  • DOI
    10.1109/ISSE.2008.5276582
  • Filename
    5276582