DocumentCode :
1611480
Title :
Sub-40nm tri-gate charge trapping nonvolatile memory cells for high-density applications
Author :
Specht, M. ; Kömmling, R. ; Dreeskornfeld, L. ; Weber, W. ; Hofmann, F. ; Alvarez, D. ; Kretz, J. ; Luyken, R.J. ; Rösner, W. ; Reisinger, H. ; Landgraf, E. ; Schulz, T. ; Hartwich, J. ; Städele, M. ; Klandievski, V. ; Hartmann, E. ; Risch, L.
Author_Institution :
Infineon Technol. AG, Munich, Germany
fYear :
2004
Firstpage :
244
Lastpage :
245
Abstract :
Fully-depleted tri-gate oxide-nitride-oxide (ONO) transistor memory cells with very short gate lengths in the range LG = 30 - 80 nm have been fabricated for the first time. The devices show very good electrical characteristics and have been optimized successfully for high density applications. A NAND-type array organization is proposed and solutions to integration issues are given. In addition, high resolution scanning spreading resistance microscopy has been used to visualize the On-state of a tri-gate memory device.
Keywords :
flash memories; semiconductor storage; 30 to 80 nm; NAND-type array organization; On-state; high resolution scanning spreading resistance microscopy; high-density applications; sub-40nm tri-gate charge trapping nonvolatile memory cells; tri-gate memory device; Dry etching; Electric resistance; Electric variables; Electrostatics; Flash memory; Lithography; Microscopy; Nonvolatile memory; Threshold voltage; Visualization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 2004. Digest of Technical Papers. 2004 Symposium on
Print_ISBN :
0-7803-8289-7
Type :
conf
DOI :
10.1109/VLSIT.2004.1345504
Filename :
1345504
Link To Document :
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