A new method for via capacitance control for high speed PCB design

Author

Rangu, Marius ; Svasta, Paul

Author_Institution

Politeh. Univ. of Timisoara, Timisoara, Romania

fYear

2008

Firstpage

616

Lastpage

621

Abstract

Modern printed circuit board design involves more than just interconnecting components, as complex high speed applications requires special concerns regarding signal integrity and electromagnetic compatibility. In order to fulfill this request, the designer need specialized software tools for modeling and electrical analysis of the physical structure of the board. This paper propose a new design technique aimed to control the capacitances of signal vias, which take advantage of the linear scaling of the electrical and geometrical characteristics of the vias.

Keywords

capacitance; electromagnetic compatibility; geometry; high-speed techniques; interconnections; printed circuit design; capacitance control; electrical analysis; electromagnetic compatibility; geometrical characteristics; high speed PCB design; interconnecting components; printed circuit board design; signal integrity; software tools; Application software; Capacitance; Computational efficiency; Computer aided engineering; Impedance; Inductance; Integrated circuit interconnections; Packaging; Printed circuits; Signal design;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Conference_Location

Budapest

Print_ISBN

978-1-4244-3972-0

Electronic_ISBN

978-1-4244-3974-4

Type

conf

DOI

10.1109/ISSE.2008.5276602

Filename

5276602