DocumentCode
1611709
Title
Availability-Constrained Multipath Protection in Backbone Networks with Double-Link Failure
Author
Ma, Han ; Fayek, Dalia ; Ho, Pin-Han
Author_Institution
Sch. of Eng., Univ. of Guelph, Guelph, ON
fYear
2008
Firstpage
158
Lastpage
164
Abstract
Reliability is crucial for high speed backbone networks. Protection mechanisms are therefore critical in the design of infrastructure networks. This paper investigates a new multi- path provisioning model with availability-guarantee on networks where events of up to two simultaneous link failures can occur. A service level agreement (SLA) which mandates service availability must be met even during network failure situations. We present a mathematical formulation to perform optimal capacity allocation in both GMPLS Self-protecting Multi-path (SPM) environment and SONET/SDH networks. Linear Programming (LP) and Integer Linear Programming (ILP) models are formulated in this study to provide multi-path protection mechanisms on MPLS and SONET/SDH networks. Network Service Providers (NSP) could use this mathematical model to design a network with certain availability requirement according to a priori defined SLAs to accommodate network traffic under dual link failure scenarios.
Keywords
SONET; integer programming; linear programming; multiprotocol label switching; synchronous digital hierarchy; telecommunication network reliability; telecommunication traffic; GMPLS self-protecting multipath environment; SONET/SDH network; availability-constrained multipath protection; double-link network failure; generalized multiprotocol label switching; high speed backbone network; integer linear programming; network service provider; network traffic; optimal capacity allocation; service level agreement; Availability; Integer linear programming; Linear programming; Mathematical model; Multiprotocol label switching; Protection; SONET; Scanning probe microscopy; Spine; Synchronous digital hierarchy;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications, 2008. ICC '08. IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2075-9
Electronic_ISBN
978-1-4244-2075-9
Type
conf
DOI
10.1109/ICC.2008.37
Filename
4533073
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