Title :
Forward scattered scanning electron microscopy for semiconductor metrology and failure analysis
Author :
Vanderlinde, W.E.
Author_Institution :
Lab. for Phys. Sci., College Park, MD, USA
Abstract :
Summary form only given. Continuing decreases in electron device feature size have strained the resolution limits of scanning electron microscopy (SEM). In this paper, a simple method is demonstrated for producing significantly improved resolution in SEM imaging without making any special sample preparation or modifications to the SEM. This method images with the low-loss forward scattered electron signal by using a modified sample holder. The method was found to be particularly useful for observing low atomic number materials such as photoresist and molecular semiconductors in their natural state, i.e. without sputter coating.
Keywords :
failure analysis; image resolution; scanning electron microscopy; scattering; semiconductor device measurement; SEM imaging; SEM resolution limits; electron device feature size; forward scattered SEM; low atomic number materials; low-loss forward scattered electron signal; molecular semiconductors; photoresist; sample holder; scanning electron microscopy; semiconductor failure analysis; semiconductor metrology; Coatings; Electron devices; Failure analysis; Image resolution; Metrology; Resists; Scanning electron microscopy; Scattering; Semiconductor materials; Signal resolution;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Conference_Location :
Taiwan
Print_ISBN :
0-7803-8454-7
DOI :
10.1109/IPFA.2004.1345518