DocumentCode
1611758
Title
Forward scattered scanning electron microscopy for semiconductor metrology and failure analysis
Author
Vanderlinde, W.E.
Author_Institution
Lab. for Phys. Sci., College Park, MD, USA
fYear
2004
Firstpage
9
Abstract
Summary form only given. Continuing decreases in electron device feature size have strained the resolution limits of scanning electron microscopy (SEM). In this paper, a simple method is demonstrated for producing significantly improved resolution in SEM imaging without making any special sample preparation or modifications to the SEM. This method images with the low-loss forward scattered electron signal by using a modified sample holder. The method was found to be particularly useful for observing low atomic number materials such as photoresist and molecular semiconductors in their natural state, i.e. without sputter coating.
Keywords
failure analysis; image resolution; scanning electron microscopy; scattering; semiconductor device measurement; SEM imaging; SEM resolution limits; electron device feature size; forward scattered SEM; low atomic number materials; low-loss forward scattered electron signal; molecular semiconductors; photoresist; sample holder; scanning electron microscopy; semiconductor failure analysis; semiconductor metrology; Coatings; Electron devices; Failure analysis; Image resolution; Metrology; Resists; Scanning electron microscopy; Scattering; Semiconductor materials; Signal resolution;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Conference_Location
Taiwan
Print_ISBN
0-7803-8454-7
Type
conf
DOI
10.1109/IPFA.2004.1345518
Filename
1345518
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