Title :
Scanning magnetoresistive microscopy for die-level sub-micron current density mapping
Author :
Schrag, B.D. ; Liu, X.Y. ; Carter, M.J. ; Xiao, G.
Author_Institution :
Micro Magnetics, Inc., Providence, RI, USA
Abstract :
Summary form only given. In this paper, we present a new technique for fault isolation and failure analysis in integrated circuits, based on a scanning magnetoresistive imaging system. By detecting the stray magnetic fields at the surface of a chip using magnetic sensors with sub-micron spatial resolution, we are able to obtain a full map of in-plane current densities, resolving features smaller than 100 nm. We briefly discuss the capabilities and limitations of the technique and present results on a variety of frontside and backside samples.
Keywords :
current density; electric current measurement; failure analysis; fault location; integrated circuit testing; magnetic sensors; magnetoresistance; microscopy; 100 nm; IC fault isolation; backside scanning; chip surface stray magnetic fields; die-level sub-micron current density mapping; failure analysis; frontside scanning; in-plane current density mapping; magnetic sensor spatial resolution; scanning magnetoresistive imaging system; scanning magnetoresistive microscopy; Circuit faults; Current density; Failure analysis; Magnetic force microscopy; Magnetic sensors; Magnetoresistance; Spatial resolution;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the
Conference_Location :
Taiwan
Print_ISBN :
0-7803-8454-7
DOI :
10.1109/IPFA.2004.1345519
