DocumentCode :
1611918
Title :
3D-microfluidic reactor in LTCC
Author :
Schirmer, M. ; Uhlemann, J. ; Rebenklau, L. ; Bauer, T. ; Wolter, K.J.
Author_Institution :
Dept. of Electr. Eng. & Inf. Technol., Tech. Univ. Dresden, Dresden, Germany
fYear :
2008
Firstpage :
484
Lastpage :
489
Abstract :
The study and verification of fluids and chemical reactions in the macroscopic range is widespread in the pharmacy, in the chemical engineering and in the medical and biotechnological industry. By transferring the reactor structures in microfluidic solutions the process parameters can be improved, analyses optimized as well as new ranges of applications opened. The preliminary works of our department show that the thick layer technology and especially the multilayer technology by means of Low Temperature Cofiring Ceramic (LTCC) offer a promising possibility for the miniaturizations of fluidic devices. The aim of this work was the conversion of parameter specifications from the chemical engineering in a first pattern construction of a LTCC microreactor. Thereby sensors for the measurement of the fluidic characteristics had to be integrated into this compound and their utilizability had to be proved.
Keywords :
ceramic packaging; chemical engineering; flow sensors; microfluidics; microreactors; multilayers; 3D-microfluidic reactor; LTCC; chemical engineering; chemical reactions; fluid verification; fluidic characteristics; fluidic device miniaturization; low temperature cofiring ceramics; microreactor construction; multilayer technology; thick layer technology; Ceramics; Chemical engineering; Chemical industry; Chemical sensors; Chemical technology; Inductors; Microfluidics; Nonhomogeneous media; Sensor phenomena and characterization; Temperature sensors; LTCC; microfluidic; microsystem; sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on
Conference_Location :
Budapest
Print_ISBN :
978-1-4244-3972-0
Electronic_ISBN :
978-1-4244-3974-4
Type :
conf
DOI :
10.1109/ISSE.2008.5276614
Filename :
5276614
Link To Document :
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