X-ray inspection of microwire bonds

The chip manufacturers are loading more functions onto smaller silicon chips, challenging the back end assembly, which cover dicing, die attach, wire bonding, encapsulation, form and test. High density packages are pushing the limits of equipment and process. Micro wire bonding is the process of connecting the silicon chip to external contacts of the package. Different types of wires are used for the wire bond process example: gold (Au), aluminum (Al). They are both ductile enough to withstand deformation during the bonding steps - while remaining strong and reliable - and highly conductive. X-ray inspection is widely used to inspect and analyze micro wire bonds because ^s ing X-ray - it makes hidden anomalies visible. Integrated circuits - after packaging - cover their micro wire bonds and the optical testers are unsuitable for check them, and X-ray inspection systems are suitable for check these hidden wires. As conclusion, this article has presented, how we can use X-ray inspection systems to see through and into the integrated circuits and how to check hidden wire anomalies