DocumentCode
1611947
Title
A measurement method for placement capability of ultrasonic wedge-wedge wire bonding process
Author
Krille, S. ; Fritzsche, H. ; Bauer, R. ; Keil, M. ; Wohlrabe, H.
fYear
2005
Firstpage
10
Lastpage
14
Keywords
Aluminum; Bonding processes; Electric variables measurement; Electronics packaging; Laboratories; Manufacturing; Microelectronics; Optical interconnections; Ultrasonic variables measurement; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Print_ISBN
0-7803-9325-2
Type
conf
DOI
10.1109/ISSE.2005.1490989
Filename
1490989
Link To Document