Resistance monitoring vehicle for advanced copper process technology

Author

de Jong, J.L. ; Hsueh, I-Chin Emily ; Nguyen, Leon Ly ; Nguyen, Tracy ; Gitlin, Daniel

Author_Institution

Xilinx, Inc., San Jose, CA, USA

fYear

2004

Firstpage

37

Lastpage

39

Abstract

This paper describes the design, testing and failure analysis results of a test chip especially designed to detect resistive contacts, vias and metal lines in advanced copper technologies. Cumulative distribution plots of the measured resistance and FIB cross-section pictures of the defective contacts and vias found in 90 nm and 130 nm processes are shown.

Keywords

copper; electric resistance measurement; failure analysis; focused ion beam technology; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; 130 nm; 90 nm; Cu; FIB cross-section pictures; copper process technology; defective contacts; failure analysis; resistance monitoring test chip; resistive contacts; resistive metal lines; resistive vias; Circuit testing; Condition monitoring; Contact resistance; Copper; Current measurement; Electrical resistance measurement; Failure analysis; Intelligent vehicles; Logic testing; Semiconductor device measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the

Print_ISBN

0-7803-8454-7

Type

conf

DOI

10.1109/IPFA.2004.1345531

Filename

1345531