• DocumentCode
    1612081
  • Title

    Interconnect modeling with the existence of line inductance

  • Author

    El-Moursy, Magdy A. ; Shawkey, Heba A.

  • Author_Institution
    Mentor Graphics Corp., Cairo, Egypt
  • fYear
    2011
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Simple uniform reduced order model is used to model an RLC interconnect line. Waveform characterization is used to evaluate the accuracy of the adopted models. As compared to RC lines, less than five times the number of sections is sufficient to model RLC lines. Look-up tables are provided to simplify the process of choosing the best interconnect section model to characterize an RLC interconnect line. The tables are shown to be accurate for wide range of relative impedance of the driver, the line, and the load. The tables provide a simple and quick mean to characterize an RLC interconnect which is necessary for performance evaluation in digital circuits. The presented model reduces the simulation time while keeping the simulation accuracy. The simulation time can be reduced by up to 72% with less than 10% reduction in accuracy using the provided tables.
  • Keywords
    RLC circuits; digital integrated circuits; integrated circuit interconnections; integrated circuit modelling; performance evaluation; reduced order systems; RLC interconnect line; digital circuit; interconnect modeling; line inductance; performance evaluation; relative impedance; simple uniform reduced order model; waveform characterization; Accuracy; Computational modeling; Impedance; Integrated circuit interconnections; Integrated circuit modeling; Load modeling; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Communications and Photonics Conference (SIECPC), 2011 Saudi International
  • Conference_Location
    Riyadh
  • Print_ISBN
    978-1-4577-0068-2
  • Electronic_ISBN
    978-1-4577-0067-5
  • Type

    conf

  • DOI
    10.1109/SIECPC.2011.5876996
  • Filename
    5876996