DocumentCode :
1612162
Title :
Using Pt Dopant and Sol Gel Technology for Sensitivity Enhancement of TiO2/SnO2Humidity Sensors
Author :
Chang, Wen-Yang ; Ke, Wen-Wang ; Hsieh, Yu-Sheng ; Kuo, Nai-Hao ; Lin, Yu-Cheng
Author_Institution :
Dept. of Eng. Sci., Nat. Cheng Kung Univ., Tainan
fYear :
2005
fDate :
6/27/1905 12:00:00 AM
Firstpage :
1937
Lastpage :
1940
Abstract :
The sensitivity of the humidity sensor based on hybrid thin films of nanostructure TiO2/SnO2 with Pt dopant was successfully increased. The humidity-sensitive materials, TiO2/SnO2, were prepared by sol gel technology. The microstructure of the sensing film after calcination was investigated by the field emission gun scanning electron microscopy (FESEM) and revealed that the metal oxide hybrid had about 10 nm grain size. For studying the effect of Pt dopant on the humidity-sensitive responses, 1 ml to 10 ml of Pt standard solution was added into the colloidal solution. To compare the humidity sensor of Pt dopant with that of no Pt dopant, operational frequencies and electrode spacing were set under the relative humidity from 30% to 95% at the ambient temperature of 22degC. We demonstrated that adding Pt dopant remarkably enhanced the sensitivity of TiO2/SnO2 humidity sensor, and further decreased the TiO2/SnO2 resistance, which was 3.3 times lower than that without Pt dopant at the high humidity
Keywords :
calcination; doping; electrodes; grain size; humidity sensors; nanostructured materials; platinum; scanning electron microscopy; sol-gel processing; thin films; tin compounds; titanium compounds; 22 degC; Pt dopant; TiO2-SnO2:Pt; calcination; colloidal solution; electrode; field emission gun scanning electron microscopy; humidity sensors; hybrid thin films; microstructure; nanostructure; sensitivity enhancement; sol gel technology; Calcination; Electron emission; Frequency; Grain size; Humidity; Microstructure; Nanostructured materials; Scanning electron microscopy; Temperature sensors; Thin film sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
Conference_Location :
Shanghai
Print_ISBN :
0-7803-8741-4
Type :
conf
DOI :
10.1109/IEMBS.2005.1616831
Filename :
1616831
Link To Document :
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