Experimental characterization of 3D micro-contacts

The present article describes the experimental characterization of construction-technology parameters of 3D micro-contacts, implemented in IC package to PCB assembly and micro mechanical actuators. This paper presents experimental results of the horizontal elements investigation, relative to the 3D micro-contacts. Thermal simulations of the proposed structures are also included. This issue is of a great importance, due to the nature of the horizontal elements - actuator type and bending features. The test structures are made electro-chemically of two micro-junction elements: a pin over a chip-carrier and a ring over a substrate-carrier. The tight contact between the pin and the ring during the fitting of micro-junction structures is a guarantee for the electric contact and heat transfer. The thermal optimization of construction-technology parameters of the 3D micro-contacts from stud-ring type is achieved by use of CFD simulations. A 3D numerical model, based on computational fluid dynamics, was constructed to represent the whole package. For the sake of model simplicity, during the modeling procedure it was considered the components that have the most representative size and power dissipation.