DocumentCode :
1612442
Title :
Analysis of transient radiation effects in III–V compound high electron mobility transistors using mixed-mode 3D simulations
Author :
Turowski, Marek ; Raman, Ashok ; Fedoseyev, Alex ; McMorrow, Dale ; Boos, J. Brad
Author_Institution :
CFD Res. Corp. (CFDRC), Huntsville, AL, USA
fYear :
2010
Firstpage :
391
Lastpage :
396
Abstract :
The paper presents details of our physics-based three-dimensional (3D) device modeling coupled in mixed-mode with external load circuit and parasitics, which enabled accurate simulation of single-event effects (SEEs) in III-V compound high electron mobility transistors (HEMTs). We show the importance of correct device physics models, such as Schottky barriers and tunneling, as well as effects of parasitics modeling, for correct computation of both steady-state and transient characteristics of III-V HEMTs. Mixed-mode coupling of a realistic load circuit, including experimental parasitics, with the 3D TCAD device model, is critical to be able to compute single-event transient current waveforms and charge collection characteristics that reflect well experimental results.
Keywords :
III-V semiconductors; Schottky barriers; electronic engineering computing; high electron mobility transistors; semiconductor device models; technology CAD (electronics); 3D TCAD device model; SEE; Schottky barriers; external load circuit; high electron mobility transistors; load circuit; mixed-mode 3D simulations; parasitics modeling; physics-based three-dimensional device modeling; single-event effects; single-event transient current waveforms computation; steady-state characteristics; transient characteristics; transient radiation effects; Computational modeling; HEMTs; Integrated circuit modeling; Load modeling; MODFETs; Solid modeling; Three dimensional displays; HEMT; High-speed III–V compound semiconductor technologies; InAlAs; InGaAs; InP; mixed-mode simulation; radiation effects; single-event effects;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference
Conference_Location :
Warsaw
Print_ISBN :
978-1-4244-7011-2
Electronic_ISBN :
978-83-928756-4-2
Type :
conf
Filename :
5551333
Link To Document :
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