• DocumentCode
    1612442
  • Title

    Analysis of transient radiation effects in III–V compound high electron mobility transistors using mixed-mode 3D simulations

  • Author

    Turowski, Marek ; Raman, Ashok ; Fedoseyev, Alex ; McMorrow, Dale ; Boos, J. Brad

  • Author_Institution
    CFD Res. Corp. (CFDRC), Huntsville, AL, USA
  • fYear
    2010
  • Firstpage
    391
  • Lastpage
    396
  • Abstract
    The paper presents details of our physics-based three-dimensional (3D) device modeling coupled in mixed-mode with external load circuit and parasitics, which enabled accurate simulation of single-event effects (SEEs) in III-V compound high electron mobility transistors (HEMTs). We show the importance of correct device physics models, such as Schottky barriers and tunneling, as well as effects of parasitics modeling, for correct computation of both steady-state and transient characteristics of III-V HEMTs. Mixed-mode coupling of a realistic load circuit, including experimental parasitics, with the 3D TCAD device model, is critical to be able to compute single-event transient current waveforms and charge collection characteristics that reflect well experimental results.
  • Keywords
    III-V semiconductors; Schottky barriers; electronic engineering computing; high electron mobility transistors; semiconductor device models; technology CAD (electronics); 3D TCAD device model; SEE; Schottky barriers; external load circuit; high electron mobility transistors; load circuit; mixed-mode 3D simulations; parasitics modeling; physics-based three-dimensional device modeling; single-event effects; single-event transient current waveforms computation; steady-state characteristics; transient characteristics; transient radiation effects; Computational modeling; HEMTs; Integrated circuit modeling; Load modeling; MODFETs; Solid modeling; Three dimensional displays; HEMT; High-speed III–V compound semiconductor technologies; InAlAs; InGaAs; InP; mixed-mode simulation; radiation effects; single-event effects;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mixed Design of Integrated Circuits and Systems (MIXDES), 2010 Proceedings of the 17th International Conference
  • Conference_Location
    Warsaw
  • Print_ISBN
    978-1-4244-7011-2
  • Electronic_ISBN
    978-83-928756-4-2
  • Type

    conf

  • Filename
    5551333