Title :
Lead free solder material compatibility and technological factors
Author :
Starý, Jirí ; Szendiuch, Ivan
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol.
Abstract :
Implementation of lead free soldering process needs new experience based on plenty of investigation in the way of effects and interactions during soldering. Material selection of solder alloy composition, type of flux, substrate surface treatments, temperature profile including influence of controlled/noncontrolled soldering atmosphere in optimized soldering process have to be compatible to reach the best results in wetting characteristics, solder joint formation, and final solder joint reliability. This paper is focused on wetting and spreading phenomena including investigation of effects and interactions during lead free solder process. There were compared SA and SAC solders with SnPb. Design of experiments (DOE) was used as very useful tool to help in this characteristic study
Keywords :
copper alloys; design of experiments; silver alloys; soldering; solders; tin alloys; wetting; SA solders; SAC solders; SnAgCu; design of experiments; lead free solder material compatibility; lead free soldering; spreading phenomena; wetting characteristics; Atmosphere; Composite materials; Environmentally friendly manufacturing techniques; Joining materials; Lead; Materials reliability; Soldering; Surface treatment; Temperature control; US Department of Energy;
Conference_Titel :
Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005. 28th International Spring Seminar on
Conference_Location :
Wiener Neustadt
Print_ISBN :
0-7803-9325-2
DOI :
10.1109/ISSE.2005.1491007
